Advanced Energy Industries, Inc. (AEIS) makes power conversion products that transform power into various usable forms and in various markets such as semiconductor devices, flat panel displays, solar panels, and architectural glass. Its power and control technologies are used in thin-film manufacturing and solar power generation.
In April 2013, the company acquired REFUsol Holding GmbH, a leading provider of 3-phase string solar PV inverters that are used for commercial applications. This acquisition will add tremendous growth potential and makes Advanced Energy an attractive addition to your summer shopping list.
REFUsol Acquisition - Smart, Strategic Move
The REFUsol acquisition is a smart strategic move by Advanced Energy.
It will help Advanced Energy add a product line that complements as well as expands its existing solar products portfolio.
Top 5 Transportation Stocks To Buy Right Now: USmart Mobile Device Inc (UMDI)
USmart Mobile Device Inc., formerly ACL Semiconductors Inc., incorporated on September 17, 2002, the Company is engaged primarily in the business of distributing memory products under the Samsung brand name, which consists of Dynamic Random Access Memory (DRAM), Graphic Random Access Memory (Graphic RAM) and Flash for the Hong Kong and Southern China markets. The primary products the Company distributes and sells include Synchronous Dynamic Random Access Memory (SDRAMs), DDRs (DDR1, DDR2 and DDR3), Flash memory, Graphic RAM and LCD panels. In September 2012, the Company acquired Jussey Investments Limited.
Synchronous Dynamic Random Access Memory (SDRAMs), or mobile SDRAM, are used semiconductor memory component in computer peripherals, such as Hard Disk Drives (HDD), Digital Still Camera (DSC), Modems, ADSL Applications, DVD player, Set-top Box (STB), Digital TV, High Definition TV (HDTV) and Portable Multimedia Players (PMP). DDRs (DDR1, DDR2 and DDR3) are random access memory components that transfer data on both 0-1 and 1-0 clock transitions, theoretically yielding twice the data transfer rate of normal RAM or SDRAM.
Flash memory is a specialized type of memory component used to store user data and program code; it retains this information even when the power is off. Although Flash is predominantly used in mobile phones and tablets, it is commonly used in multi-media digital storage applications for products, such as moving picture experts group layer-3 audio (MP3) players, digital still camera DSC, Digital Voice Recorders, universal serial bus (USB) Disks and Flash Cards. Graphic RAM is a special purpose DDR (GDDR1, GDDR2, GDDR3, GDDR4) that is used in graphic products which require high-speed 3-dimensional calculation performance and a memory size to be used as data storage buffer for digital versatile disc (DVD) and computer game displays. LCD panels are a component in consumer electronics, such as LCD TVs, tablets, smartphones, notebooks, digital phone frames and por! table game consoles.
The Company competes with Toshiba, Hynix, Nanya, PSC, Promos, ISSI and ESMT.
Advisors' Opinion:- [By Peter Graham]
Last Friday, small cap stocks MedCAREERS Group Inc (OTCMKTS: MCGI), USmart Mobile Device Inc (OTCMKTS: UMDI) and Drinks Americas Holdings, Ltd (OTCMKTS: DKAM) were all over the place with the first two sinking 54% and 48.05%, respectively, while the last one rose 10.81%. It should be mentioned that all three small cap stocks have been the subject of paid promotions albeit none of these stocks have been over promoted. So where can investors and traders expect these stocks to head this week? Here is a quick look at what you might expect:
Top Semiconductor Companies For 2014: M/A-COM Technology Solutions Holdings Inc (MTSI)
M/A-COM Technology Solutions Holdings, Inc. (M/A-COM), incorporated on March 25, 2009, is a provider of high-performance analog semiconductor solutions for uses in wireless and wireline applications across the radio frequency (RF), microwave and millimeter wave spectrum. The Company manages has one segment, which is semiconductors. The Company offers over 2,700 standard and custom devices, which includes integrated circuits (IC), multi-chip modules, power pallets and transistors, diodes, switches and switch limiters, passive and active components and complete subsystems, across 37 product lines serving over 6,000 end customers in four primary markets. The Company's semiconductor products are electronic components that the Company's customers incorporate into their larger electronic systems, such as point-to-point wireless backhaul radios, radar, automobile navigation systems, digital cable television (CATV) set-top boxes, magnetic resonance imaging systems and unmanned aerial vehicles. In February 2014, M/A-COM Technology Solutions Holdings Inc announced that its subsidiary Mindspeed Technologies Inc completed the sale of assets of its wireless infrastructure business unit to Intel Corporation.
The Company's primary markets are Networks, which includes CATV, cellular backhaul, cellular infrastructure and fiber optic applications; Aerospace and Defense (A&D); Automotive, which includes global positioning system (GPS) modules sold to the automotive industry; and Multi-market, which includes industrial, medical, mobile communications and scientific applications. The Company operates a single Gallium Arsenide (GaAs) and silicon semiconductor fab at its Lowell, Massachusetts headquarters, which the Company is in the process of updating to include Gallium Nitride (GaN) fabrication operations as well. The Company also utilizes external semiconductor foundries to supply the Company with additional capacity in periods of high demand and to provide the Company access to additional process technolog! ies. The ability to utilize a broad array of internal process technologies as well as commercially available foundry technologies allows the Company to select the appropriate technology to solve the Company's customers' needs.
The Company offers high-performance analog semiconductor products for both wireless and wireline applications across the frequency spectrum from RF to millimeterwave. The Company regularly develops high-value products to serve its customers in four primary markets: Networks, A&D, Multi-market and Automotives.
Aerospace & Defense
In the A&D market, military applications require more advanced electronic systems, such as radar warning receivers, communications data links and tactical radios, unmanned aerial vehicles (UAVs), RF jammers, electronic countermeasures and smart munitions. Military applications are becoming more sophisticated, favoring higher performance semiconductor ICs based on GaAs and GaN technology due to their high power density, improved power efficiency and broadband capability. Radar systems for mapping and targeting missions are undergoing a transition from existing mechanically-scanned radar products to a new generation of active electronically-scanned array (AESA) based products. Consisting of hundreds or thousands of transmit/receive modules commonly based on GaAs and increasingly on GaN technology, AESAs deliver greater speed, range, resolution and reliability over mechanically-scanned radar products that utilize a single transmitter and receiver with mechanical steering. Military communications employing wireless infrastructure and tactical radios in the field remain critical for allowing geographically dispersed users to exchange information quickly and efficiently. UAVs and their underlying semiconductor content requires designs to meet rigorous specifications for high performance, small size, and low power consumption.
Automotive
The Automotive category includes GPS modules the Company sel! ls to the! automotive industry. Semiconductor content in automobiles is projected to grow in order to offer connectivity, safety, performance and navigation features.
Multi-market
In Multi-market, the Company's products are used in industrial, medical, mobile communications, test and measurement and scientific applications. In the medical industry, the Company's custom designed non-magnetic diode product line is a critical component for certain MRI applications. The Company offers a broad range of standard and custom ICs, modules and complete subsystems across 37 product lines. The Company's product portfolio consists of more than 2,700 products including the key product platforms: power pallets and transistors, ICs, diodes, switches and switch limiters, passive and active components, multi-chip modules, and complete subsystems. Many of the Company's product platforms are leveraged across multiple markets and applications. For example, the Company's applications with regard to power transistor technology is leveraged across both scientific laboratory equipment applications and commercial and defense radar system applications. The Company's diode technology is used in switch filter banks of military tactical radios as well as medical imaging MRI systems.
The Company competes with Hittite Microwave Corporation, Sumitomo Electric Device Innovations, Inc., RF Micro Devices, Inc. (RFMD), Avago, Inc. (Avago), Aeroflex, Inc. (Aeroflex), Microsemi Corporation (Microsemi), TriQuint and Skyworks Solutions, Inc.
Advisors' Opinion:- [By Monica Gerson]
Mindspeed Technologies (NASDAQ: MSPD) surged 69.02% to $5.02 in the pre-market session after M/A-Com Technology Solutions Holdings (NASDAQ: MTSI) announced its plans to acquire Mindspeed Technologies.
- [By Seth Jayson]
M/A-Com Technology Solutions Holdings (Nasdaq: MTSI ) reported earnings on April 30. Here are the numbers you need to know.
The 10-second takeaway
For the quarter ended March 29 (Q2), M/A-Com Technology Solutions Holdings met expectations on revenues and beat expectations on earnings per share. - [By Lauren Pollock]
M/A-COM Technology Solutions Holdings Inc.(MTSI) agreed to acquire semiconductor manufacturer Mindspeed Technologies Inc.(MSPD) in a deal valued at $272 million, expanding the company’s markets to include enterprise applications. Mindspeed shares surged 70% to $5.04 premarket.
Top Semiconductor Companies For 2014: Micropac Industries Inc (MPAD)
Micropac Industries, Inc. (Micropac), incorporated on March 3, 1969, manufactures and distributes various types of hybrid microelectronic circuits, solid state relays, power operational amplifiers, and optoelectronic components and assemblies. Micropac�� products are used as components in a range of military, space and industrial systems, including aircraft instrumentation and navigation systems, power supplies, electronic controls, computers, medical devices, and high-temperature (200o degree Celsius) products. The Company�� products are either custom (being application-specific circuits designed and manufactured to meet the particular requirements of a single customer) or standard components. During the fiscal year ended December 31, 2011 (fiscal 2011), its custom-designed components accounted for approximately 34% of its revenue and standard components accounted for approximately 66% of its revenue.
Micropac occupies approximately 36,000 square feet of manufacturing, engineering and office space in Garland, Texas. The Company owns 31,200 square feet of that space and leases an additional 4,800 square feet. It also sub-contracts some manufacturing to Inmobiliaria San Jose De Ciuddad Juarez S.A. DE C.V, a maquila contract manufacturer in Juarez, Mexico.
Micropac provides microelectronic and optoelectronic components and assemblies along with contract electronic manufacturing services, and offers a range of products sold to the industrial, medical, military, aerospace and space markets. The Microcircuits product line includes custom microcircuits, solid state relays, power operational amplifiers, and regulators. During fiscal 2011, microcircuits product line accounted for 51% of its revenue and the optoelectronics product line accounted for 62% of its business respectively. The Company�� core technology is the packaging and interconnects of miniature electronic components, utilizing thick film and thin film substrates, forming microelectronics circuits. Other technologi! es include light emitting and light sensitive materials and products, including light emitting diodes and silicon phototransistors used in its optoelectronic components, and assemblies.
The Company�� basic products and technologies include custom design hybrid microelectronic circuits, solid state relays and power controllers, custom optoelectronic assemblies and components, optocouplers, light-emitting diodes, Hall-Effect devices, displays, power operational amplifiers, fiber optic components and assemblies, and high temperature (200o degree Celsius) products. Micropac�� products are primarily sold to original equipment manufacturers (OEM��) who serve major markets, which includes military/aerospace, such as aircraft instrumentation, guidance and navigations systems, control circuitry, power supplies and laser positioning; space, which include control circuitry, power monitoring and sensing, and industrial, which includes power control equipment and robotics.
The Company�� products are marketed throughout the United States and in Western Europe. During fiscal 2011, approximately 21% of the Company�� revenue was from international customers. The Company�� major customers include contractors to the United States Government. During fiscal 2010, sales to these customers for the Department of Defense (DOD) and National Aeronautics and Space Administration (NASA) contracts accounted for approximately 62% of its revenues. The Company�� customers are Lockheed Martin, Northrop Grumman, Boeing, Rockwell Int��, and NASA.
The Company compete with Teledyne Industries, Inc., MS Kennedy, Honeywell, Avago and International Rectifier.
Advisors' Opinion:- [By Geoff Gannon] % of NCAV, has similar (slightly better) z- and f-scores, a FCF margin of 6%, but has ROA of 28%.
ADDvantage (AEY) sells at 95% of NCAV, has similar (in the ballpark) scores and FCF and ROA of 23%.The slightly better businesses are currently more expensive in terms of price/NCAV. They have less asset-based downside protection, but they are better businesses.
How do you quantify and qualify what is cheap enough? To me, there's a big difference in relative cheapness in a company selling at 74% of NCAV versus one selling at 95%. I'm wondering if I'm putting too much weight on this cheapness measurement instead of acknowledging that any decent business selling at less than NCAV is cheap enough. Yet, one has to have some quantifiable idea of when something is not cheap enough anymore.
Can you help me put this into a unified framework?
Dan
There�� a great post over at Oddball Stocks called: �� Stock is a Business�� Read it. Then go over to Richard Beddard�� Interactive Investor Blog. Bookmark that blog. Read it religiously. He looks at Ben Graham type stocks in the U.K. And he looks at them not just as stocks but as pieces of a business.
Here�� what Richard said in a post called ��iving Up on Mastery of the Universe��
I need to know:
1. Whether the managers have made good decisions in the past, and whether their incentives work in the interests of the owners, because those kind of managers often add value to a company.
2. The products a company sells will still be in demand for years to come, because if they��e not then the past, which we know, does not tell us anything about the future, which we don��.
3. A company is financially strong enough to withstand the kinds of shocks companies typically experience bearing in mind some are more sensitive to events than others.
4. How to judge whether the share price undervalues the company, bearing in mind the preceding three factors.
Top Semiconductor Companies For 2014: Analog Devices Inc (ADI)
Analog Devices, Inc. (Analog Devices), incorporated on January 18, 1965, is engaged in the design, manufacture and marketing of a range of analog, mixed-signal and digital signal processing integrated circuits (ICs). The Company produces a range of products, including data converters, amplifiers and linear products, radio frequency (RF) ICs, power management products, sensors based on micro-electro mechanical systems (MEMS) technology and other sensors, and processing products, including DSP and other processors, which are designed to meet the needs of a base of customers. The Company's products are embedded inside many different types of electronic equipment, including industrial process control systems; instrumentation and measurement systems; wireless infrastructure equipment, and aerospace and defense electronics. The Company designs , manufactures and markets a range of ICs, which incorporate analog, mixed-signal and digital signal processing technologies. The Company's product portfolio includes both general-purpose products used by a range of customers and applications, as well as application-specific products. On March 30, 2012, the Company acquired Multigig, Inc.
Analog Products
The Company's product portfolio includes several thousand analog ICs. The Company's analog IC customers include original equipment manufacturers (OEMs) and customers who build electronic subsystems for integration into larger systems. The Company is a supplier of data converter products. Data converters translate real-world analog signals into digital data and also translate digital data into analog signals. The Company is also a supplier of amplifiers. Amplifiers are used to condition analog signals. The Company provides precision, instrumentation, intermediate frequency/radio frequency (RF), broadband, and other amplifiers. The Company also offers a range of precision voltage references, which are used in a range of applications. The Company's analog product line also includes a range port! folio of RF ICs covering the RF signal chain, from RF function blocks, such as phase locked loops, frequency synthesizers, mixers, modulators, demodulators, and power detectors, to broadband and short-range single chip transceiver solutions.
The Company's RF ICs support the requirements of cellular infrastructure and a range of applications in the Company's target markets. Also within the Company's analog technology portfolio are products, which are based on MEMS technology. This technology enables the Company to build small sensors, which incorporate an electromechanical structure and the supporting analog circuitry for conditioning signals obtained from the sensing element. The Company's MEMS product portfolio includes accelerometers used to sense acceleration, gyroscopes used to sense rotation, inertial measurement units used to sense multiple degrees of freedom combining multiple sensing types along multiple axis, and MEMS microphones used to sense audio. The Company's current revenue from MEMS products is derived from the automotive end market. In addition to the Company's MEMS products, its other analog product category includes isolators. The Company's isolators have been designed for applications, such as universal serial bus isolation in patient monitors, where it allows hospitals and physicians to adopt the advances in computer technology to supervise patient health and wirelessly transmit medical records. In smart metering applications, the Company's isolators provide electrostatic discharge performance. In satellites, where any malfunction can be catastrophic, the Company's isolators help protect the power system while enabling designers to achieve small form factors. Power management & reference products make up the balance of the Company's analog sales. Those products, which include functions such as power conversion, driver monitoring, sequencing and energy management, are developed to complement analog signal chain components across core market segments from micro power, en! ergy-sens! itive battery applications to power systems in infrastructure and industrial applications.
Digital Signal Processing Products
Digital Signal Processing products (DSPs) complete the Company's product portfolio. DSPs are optimized for numeric calculations, which are essential for instantaneous, or real-time, processing of digital data generated, from analog to digital signal conversion. The Company's DSPs are designed to be fully programmable and to execute specialized software programs, or algorithms, associated with processing digitized real-time, real-world data. Programmable DSPs are designed to provide the flexibility to modify the device's function using software. The Company's DSP IC customers write their own algorithms using software development tools provided by the Company and third-party suppliers. The Company's DSPs are designed in families of products, which share common architectures and therefore can execute the same software across a range of products. The Company's customers use the Company's products to solve a range of signal processing challenges across its core market and segment focus areas within the industrial, automotive, consumer and communications end markets. As an integrated part of the Company's customers' signal chain, there are other Analog Devices products connected to its processors, including converters, audio and video codecs and power management solutions.
The Company competes with Broadcom Corporation, Maxim Integrated Products, Inc., Cirrus Logic, Inc., Microchip Technology, Inc., Freescale Semiconductor, Inc., NXP Semiconductors, Infineon Technologies, ST Microelectronics, Intersil Corporation, Silicon Laboratories, Inc., Knowles Electronics, Texas Instruments, Inc. and Linear Technology Corporation.
Advisors' Opinion:- [By Lauren Pollock]
Analog Devices Inc.'s(ADI) fiscal fourth-quarter earnings rose 13% as stronger margins and asset-sale gains and other items offset the chip maker’s lower revenue.
- [By Harsh Chauhan]
It is not just auto companies that are benefiting from this growth. Even chipmakers have cashed in on this trend as vehicles get more advanced and are equipped with more technology. Analog Devices (NASDAQ: ADI ) is one such semiconductor company which has trained its sights on the resurgent auto market. It recently announced the acquisition of Hittite Microwave (NASDAQ: HITT ) to bolster its position in automotive, along with other verticals.�
- [By Rich Smith]
Analog Devices (NASDAQ: ADI ) has a new boss.
On Monday, Analog announced it has confirmed 25-year company veteran and current interim Chief Executive Officer Vincent Roche as its new CEO.
Top Semiconductor Companies For 2014: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By Seth Jayson]
Advanced Semiconductor Engineering (NYSE: ASX ) is expected to report Q2 earnings around July 7. Here's what Wall Street wants to see:
- [By Adam Haigh]
ASX Ltd. (ASX) posted the biggest weekly loss in 3 1/2 years, falling 6.1 percent to A$33.15, amid a A$553 million ($530 million) capital raising at the operator of Australia�� main stock exchange to ensure its clearing business complies with new regulations.
- [By Jeff Reeves]
Advanced Semiconductor Engineering�(ASX) builds and distributes integrated circuits and other electronics. It�� not as sexy as some mobile chipmakers, but thankfully it doesn�� have to be — ASX is simply capitalizing on the general demand for microchips in everything from cars to computers to TVs.
- [By David Dittman]
Crown Resorts is a buy all the way up to USD16.50 on the Australian Securities Exchange (ASX) using the symbol CWN and on the US over-the-counter (OTC) market using the symbol CWLDF.
Top Semiconductor Companies For 2014: Peregrine Semiconductor Corp (PSMI)
Peregrine Semiconductor Corporation (Peregrine), incorporated in February 1990, is engaged in the design, manufacturing and marketing radio frequency integrated circuits (RFICs) for the aerospace and defense, broadband, industrial, mobile wireless device, test and measurement equipment, and wireless infrastructure markets. The Company is provider of RFICs. Its products include RF switches-antenna, RFswitches-broadband and general purpose, digital attenuators, synthesizers, mixers/upconverters, prescalers, variable gain amplifiers, digitally tunable capacitors, DC-DC converters and power amplifiers. Its UltraCMOS technology enables the design, manufacture, and integration of multiple radio frequency (RF), mixed signal, and digital functions on a single chip. Its solutions target a range of applications in the aerospace and defense, broadband, industrial, mobile wireless device, test and measurement equipment, and wireless infrastructure markets.
As of December 25, 2010, The Company offers a portfolio of more than 120 RFICs, including switches, digital attenuators, mixers/upconverters, and prescalers, and it is developing power amplifiers (Pas), digitally tunable capacitors (DTCs), and DC-DC converters. During the fiscal year ended December 25, 2010, its products were sold to more than 1,400 module manufacturers, original equipment manufacturers (OEMs), contract manufacturers, and other customers, including such companies as Amalfi Semiconductor, Inc., The Boeing Company, EPCOS AG, Ericsson AB, Hitachi Media Electronics Company, Ltd., Hitachi Metals, Ltd., Humax Co., Ltd., Itron, Inc., LG Innotek Co., Ltd., Mini-Circuits, Inc., Motorola, Inc., Murata Manufacturing Company, Ltd., Planet Technology Corp., Rockwell Collins, Inc., Rohde & Schwarz, Inc., SIPAT Co., Ltd., Skyworks Solutions, Inc., Sony Corporation, Source Photonics, Inc., and Thales Alenia Space.
RF switches-antenna
RF Switches are utilized in the RF section of mobile devices to route RF signals between! the antenna and the handset core, through one or more signal paths. For mobile handsets, its switch products offer up to 10 RF signal paths with integrated digital bus support and onboard voltage regulation.
RFswitches-broadband and general purpose
The Company�� broadband and general purpose RF switches deliver combination of broadband linearity, settling time, and isolation while routing RF signals to their respective transmit or receive paths. Its attributes are being used by the OEMs of LED and plasma digital televisions (DTVs), set top box, cable infrastructure, test and measurement devices
Digital Attenuators
The Company provides digital step attenuators that are used to control the amplitude of an RF or analog signal. The products include digital control circuitry integrated with an RF attenuator core and are used in third generation (3G) and fourth generation (4G) cellular base stations, repeaters, and point-to-point nodes.
Synthesizers
The Company�� frequency synthesizers provide an electronic system for generating any of a range of frequencies from a single fixed timebase or oscillator. Its synthesizers provide low-power, ultra-low phase noise, programmable frequency synthesis for defense, broadband, industrial, and wireless infrastructure markets.
Mixers/Upconverters
The Company�� mixers/upconverters are used to translate encoded voice/data signals from one frequency to another to enable radio transmission. Its mixers / upconverters are incorporated into mixer modules and provide industry linearity, which is a metric to maximizing wireless data transmission rates. These attributes are critical in 3G and 4G cellular base station designs.
Prescalers
The Company�� prescalers operate in the C, X, and Ku bands to divide the frequency of a wireless signal in order to extend the operating range of a synthesizer beyond its base capability. Its prescalers complem! ent its f! requency synthesizer line, providing its customers with design.
Variable Gain Amplifiers
The Company�� Variable Gain Amplifiers (VGAs) are used in both the receiving and transmitting path of a radio system to maintain a signal�� strength at a level necessary for other circuits to operate optimally. Its DVGA is the monolithic integrated circuit (IC) to integrate three functional blocks, including digital attenuators, RF/IF amplifiers and a common serial interface onto a single IC.
DC-DC Converters
The Company�� frequency-configurable DC-DC converters efficiently perform voltage conversion using a high frequency switching technique that minimizes system noise. Its DC-DC converters are designed to enable a distributed power management architecture designed for satellite applications, replacing inefficient drop out regulators and central converters.
Power Amplifiers
The Company�� PAs amplify RF signals in order to generate the necessary power required to establish a radio link between a base station and a mobile device. With its UltraCMOS technology the Company has the ability to integrate its PAs on a single chip with other RF, mixed signal, and digital components.
The Company competes with Hittite, M/A-COM, NEC, Renesas, RFMD, Skyworks, Sony, Toshiba and TriQuint Semiconductor.
Advisors' Opinion:- [By Lee Jackson]
Peregrine Semiconductor Corp. (NASDAQ: PSMI) is a lesser known name that is a top stock to buy at Deutsche Bank. The company recently released a new radio frequency (RF) switch specifically designed for broadband cable systems. With HD content exploding, this could be a huge home run for the company. Deutsche Bank has a $14 price target for the stock, the same as the consensus target.
Top Semiconductor Companies For 2014: Texas Instruments Incorporated(TXN)
Texas Instruments Incorporated engages in the design and sale of semiconductors to electronics designers and manufacturers worldwide. The company?s Analog segment offers high-performance analog products comprising standard analog semiconductors, such as amplifiers, data converters, and interface semiconductors; high-volume analog and logic products; and power management semiconductors and line-powered systems. Its Embedded Processing segment includes DSPs that perform mathematical computations to process and enhance digital data; and microcontrollers, which are designed to control a set of specific tasks for electronic equipment. The company?s Wireless segment designs, manufactures, and sells application processors and connectivity products. Its Other segment offers smaller semiconductor products, which include DLP products that are primarily used in projectors to create high-definition images; and application-specific integrated circuits. This segment also provides handhe ld graphing and scientific calculators, as well as licenses technologies to other electronic companies. The company serves the communications, computing, industrial, consumer electronics, automotive, and education sectors. Texas Instruments Incorporated sells its products through a direct sales force, distributors, and third-party sales representatives. It has collaboration agreements with PLX Technology Inc.; Neonode, Inc.; and Ubiquisys Ltd. The company was founded in 1938 and is headquartered in Dallas, Texas.
Advisors' Opinion:- [By The Wall Street Journal]
The Dallas-based company (TXN) , whose chips are used for many kinds of devices purchased by consumers and businesses, has shifted its strategy to grapple with broad changes in the semiconductor market.
- [By Alex Planes]
Freescale's hardly the first chipmaker to step into the Internet of Things arena. A number of chips are already working in a number of devices, from wearable fitness trackers to the upcoming Google�Project Glass, making the Internet feel more like a part of your body. Texas Instruments (NASDAQ: TXN ) has gotten small and simple with bare-bones Wi-Fi chips that could pair with Freescale's microcontroller to transmit information -- if only they were a little bit smaller. No one has come up with something this small yet, and there's a reason Freescale believes that the tiny new Kinetis micro-controllers could be used to track users' health from inside their own bodies:
- [By Douglas A. McIntyre]
Big tech seems to get smaller and smaller, both in terms of sales and number of employees. International Business Machines Corp. (NYSE: IBM) said it would rebalance its workforce. Texas Instruments Inc. (NASDAQ: TXN) announced it would cut 1,100 people. These announcements come shortly after Intel Corp. (NASDAQ: INTC) said it would fire 5,000 people. While job cuts from the recession may have ended, old tech cannot afford to hold on to its workers.
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